Photoresist composition including polyphenol and sensitizer

G - Physics – 03 – F

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G03F 7/039 (2006.01) G03F 7/075 (2006.01) H01L 21/027 (2006.01)

Patent

CA 1337788

A photoresist composition, and a process for using the same are; the composition comprises a polyphenolic resin and a sensitizer effective, when exposed to actinic radiation, to provide alkali solubility to said composition, wherein said resin is represented by the formula (I) or (II): Image (I) Image Image (II) wherein R is a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an alkaryl group or an aryl group; R' is a silyl group; and n and n'+m are greater than 3. The composition exhibits high thermal and plasmal resistance and good dissolution characteristics.

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