H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/027 (2006.01) G03F 7/095 (2006.01) G03F 7/20 (2006.01)
Patent
CA 2062479
ABSTRACT OF THE DISCLOSURE A pattern, useful in the production of integrated circuits, for positioning bond pads on a substrate is formed. This process of forming this pattern includes patterning and opacifying a thin photoresist layer which acts as a conformal optical mask for a thick photoresist layer present below it. Exposure and development is then used to transfer the pattern to the thick photoresist layer. The patterned depressions formed in the thick photoresist layer can then be filled with conductive material to serve as bond pads for bonding to an integrated circuit packaging system.
Lelental Mark
Pace Laurel J.
Palmeri Rudolph F.
Weiss Armin K.
Eastman Kodak Company
Gowling Lafleur Henderson Llp
Lelental Mark
Pace Laurel J.
Palmeri Rudolph F.
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