Photoresist stripper/cleaner compositions containing...

G - Physics – 03 – F

Patent

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Details

G03F 7/42 (2006.01) C09D 9/00 (2006.01) C11D 1/04 (2006.01) C11D 3/00 (2006.01) C11D 7/26 (2006.01) C11D 7/50 (2006.01) C11D 11/00 (2006.01) C23G 1/06 (2006.01) C23G 1/18 (2006.01) C11D 7/32 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2423468

A stripping and cleaning composition for the removal of residue from metal and dielectric surfaces in the manufacture of semi-conductors and microcircuits. The composition is an aqueous system including organic polar solvents including corrosive inhibitor component from a select group of aromatic carboxylic acids used in effective inhibiting amounts. A method in accordance with this invention for the removal of residues from metal and dielectric surfaces comprises the steps of contacting the metal or dielectric surface with the above inhibited compositions for a time sufficient to remove the residues.

L'invention concerne une composition de décapage et de nettoyage destinée à l'élimination de résidus d'un métal et de surfaces diélectriques au cours de la fabrication de semi-conducteurs et de microcircuits. La composition se présente sous la forme d'un système aqueux comprenant des solvants polaires organiques renfermant un composant inhibiteur corrosif sélectionné dans un groupe d'acides carboxyliques aromatiques utilisés en quantités inhibitrices efficaces. L'invention concerne également un procédé permettant d'éliminer des résidus du métal et des surfaces diélectriques. Ce procédé comprend les étapes consistant à mettre en contact le métal ou la surface diélectrique avec les compositions inhibées susmentionnées pendant une durée suffisamment longue pour éliminer les résidus.

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