C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
149/26
C09D 9/00 (2006.01) C11D 7/50 (2006.01) C23G 5/028 (2006.01) G03F 7/42 (2006.01) C11D 7/26 (2006.01) C11D 7/28 (2006.01) C11D 7/32 (2006.01)
Patent
CA 1193177
- 14 - ABSTRACT OF THE DISCLOSURE An improved process for removing crosslinked photoresist polymer from printed circuit boards which comprises contacting the printed circuit board with dichloromethane (methylene chloride) containing from 5 to 10 volume percent of a mixture of methanol and methyl methanoate (methyl formate). Each additive must be present at a minimum concentration of one volume percent. Stabilizers for the dichloromethane, such as epoxides, may be present at amounts no greater than 0.5 volume percent. - 14 -
446329
Archer Wesley L.
Dallessandro Susan M.
Lynn Vicki A.
Sim & Mcburney
The Dow Chemical Company
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