Photosensitive composition and photosensitive planographic...

G - Physics – 03 – F

Patent

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G03F 7/023 (2006.01) G03F 7/021 (2006.01) G03F 7/039 (2006.01)

Patent

CA 2173638

A photosensitive composition which comprises a resin (A) having urea bonds in its side chains and a photosensitive compound (B), wherein the resin (A) contains at least one resin selected from the group consisting of a vinyl polymer resin and a condensation polymer resin, provides a coating layer with excellent resistance to solvents and abrasion. The photosensitive composition is suitable for use in the production of planographic printing plates, integrated circuits (IC) or photomasks. A photosensitive planographic printing plate produced usig the photosensitive composition has superior press-life.

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