G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/028 (2006.01) G03F 7/027 (2006.01) G03F 7/032 (2006.01)
Patent
CA 2057725
There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50 % by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50 % by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10 % by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40 % by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates. Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water- solubility of the polymers and copolymers. The novel compositions are photoimageable and are particularly suitable for use as solder resists.
Salvin Roger Pierre-Elie
Schulthess Adrian
Fetherstonhaugh & Co.
Vantico Ag
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