C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
88/114, 260/472.
C07C 15/30 (2006.01) C07C 15/28 (2006.01) C07C 43/164 (2006.01) C07C 69/00 (2006.01) C07C 69/347 (2006.01) C07C 69/76 (2006.01) C07C 211/61 (2006.01) C07C 233/64 (2006.01) C07C 309/63 (2006.01) C07C 309/74 (2006.01) C07C 311/16 (2006.01) G02F 1/01 (2006.01) G02F 1/29 (2006.01)
Patent
CA 2013150
ABSTRACT OF THE DISCLOSURE The present invention relates to photosensitive compounds each of which is capable of producing trans dimerization between the two aromatic ring residues in its molecule so as to allow light of 300 nm or more to pass therethrough when irradiated with ultraviolet light of 340 nm to 380 nm, and which is also capable of cutting off the passage or light of 300 nm or more when the dimerization is dissociated by the irradiation with ultraviolet light of 240 to 280 nm. The invention also relates to a photosensitive member, an optical circuit, an optical recording medium and the like, all of which contain the photosensitive compounds as components.
Ito Yutaka
Iwasaki Kishiro
Kobayashi Setsuo
Mukoh Akio
Nakamura Mariko
Hitachi Ltd.
Kirby Eades Gale Baker
LandOfFree
Photosensitive compound does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive compound, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive compound will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1935215