B - Operations – Transporting – 05 – B
Patent
B - Operations, Transporting
05
B
356/12, 356/22,
B05B 5/035 (2006.01) B05B 5/08 (2006.01) B05D 1/04 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2007968
ABSTRACT The invention relates to a method of applying a photosensitive liquid solder resist to a printed cir- cuit board and an apparatus therefor. In particular, the liquid solder resist is applied uniformly over the entire surface of the printed circuit pattern, which may include both sides of the printed circuit board, with the aid of an airless-type, electrostatic spray coating operation in which the spray nozzle is provided with auxiliary air spray nozzles for the spray pattern. Ad- herence to restrictions regarding lay-out position, tool and equipment position, liquid pressure, air pressure, and electrostatic voltage results in an improved quality of the printed circuit boards.
Corporation Nordson
Macrae & Co.
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