Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

C - Chemistry, Metallurgy

08

F

96/150, 400/4025

C08F 2/50 (2006.01) C08F 290/12 (2006.01) G03F 7/027 (2006.01) G03F 7/033 (2006.01) A63F 9/24 (2006.01)

Patent

CA 1271870

Abstract The invention provides a photosensitive resin composition suitable for a relief printing plate having good resistance to a water based ink, for which water or a water like solvent can be employed as a developing solution. The resin composition comprises (i) a poly- mer having a molecular weight of 5,000 to 500,000 which contains an amino group and a polymerizable double bond moiety: (ii) a monomer having an .alpha.,.beta.-ethylenically unsaturated bond and a free acid group which can qua- ternize the nitrogen atom of the polymer (i); (iii) a photopolymerizable unsaturated compound, and (iv) a photopolymerization initiator.

501675

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