Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

G - Physics

03

F

G03F 7/031 (2006.01)

Patent

CA 2328342

Photosensitive compositions comprising (A) an alkali soluble compound; (B) at least one compound of ,formula I or II Image (SEE FORMULA I AND II) wherein R1 inter alia is C4-C9cycloalkanoyl, C3-C12alkenoyl, or benzoyl which is unsubstituted or substituted; Ar1 is either C6-C20aryl or C6-C20aryloyl each of which is unsubstituted or sub- stituted; x is 2 or 3; M1 when x is 2, inter alia is a group phenylene or naphthylene, each of which optionally is substituted i.a. by OR3, SR4 or NR5R6; or M1, when x is 3, is a trivalent group, optionally substituted; R3 is for example hydrogen or C1-C12alkyl; C2- C6alkyl which is for example substituted by -OH, -SH, -CN, C3-C6alkenoxy, or -OCH2CH2CN; R4 is for ex- ample hydrogen, C1-C12alkyl, C3-C12alkenyl, cyclohexyl, or phenyl which is unsubstituted or substituted; R5 and R6 independently of each other inter alia are hydrogen, C1- C12alkyl, C2- C4hydroxyalkyl, C2-C10alkoxyalkyl, C3-C5alkenyl, C3-C8cycloalkyl, phenyl-C1- C3alkyl, C1- C4alkanoyl, C3-C6alkenoyl, benzoyl or phenyl which is unsubstituted or substituted; and (C) a photopolymerizable compound; exhibit an unexpectedly good performance, in particular in photoresist technology.

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