G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/095 (2006.01) G03F 1/00 (2006.01) G03F 7/00 (2006.01) G03F 7/004 (2006.01)
Patent
CA 2502254
An object of the present invention is to provide a photosensitive resin printing plate precursor capable of forming a protruding relief pattern without using any original pattern film. Specifically, the present invention relates to a photosensitive resin printing plate precursor including: a photosensitive resin layer (A) containing a water-soluble or water-dispersible resin and an ultraviolet-curable monomer; and a water-insoluble heat-sensitive mask layer (C) containing an infrared-absorbing material, deposited in that order on a support. By introducing a crosslinked structure or a hydrophobic constituent to the heat-sensitive mask layer (C) so as to be insoluble in water, difference in polarity is produced between the layers (A) and (C) and, thus, mass transfer between the two layers can be prevented. Also, the scratch resistance of the heat-sensitive mask layer (C) can be dramatically enhanced and, thus, the printing plate precursor becomes easy to handle.
La présente invention concerne un cliché matrice d'imprimerie en résine photosensible qui permet de former des images en relief sans utiliser de pellicule image originale. L'invention porte, en particulier, sur un cliché matrice d'imprimerie en résine photosensible comprenant un support et, superposées séquentiellement sur ce dernier, une couche de résine photosensible (A) comprenant une résine soluble ou dispersible dans l'eau et un monomère durcissable aux UV, et une couche de masque thermosensible non soluble dans l'eau (C) contenant une substance absorbant les infrarouges. En introduisant une structure de réticulation ou un composant hydrophobe dans la couche de masque thermosensible (C) afin de rendre cette dernière non soluble dans l'eau, on empêche le transfert de masse entre la couche (A) et la couche (C) en raison de leur différence de polarité, et on facilite la manipulation du cliché matrice étant donné que la couche de masque thermosensible (C) présente une résistance nettement améliorée aux dommages.
Adachi Tamio
Ichii Yoshiki
Ichikawa Michihiko
Tanaka Shinji
Smart & Biggar
Toray Industries Inc.
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