G - Physics – 03 – F
Patent
G - Physics
03
F
96/150
G03F 7/028 (2006.01) G03F 7/027 (2006.01) G03F 7/032 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1331711
ABSTRACT OF THE DISCLOSURE By subjecting a photosensitive thermosetting resin composition comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, which excels in developing property and sensitivity and enjoys a long shelf life, to coating, exposure to light, development, and post-curing, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.
584430
Inagaki Shoji
Kamayachi Yuichi
Sawazaki Kenji
Suzuki Morio
Sim & Mcburney
Taiyo Ink Manufacturing Co. Ltd.
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