Photosensitive transfer material and process for...

G - Physics – 03 – C

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G03C 11/12 (2006.01) G03F 7/115 (2006.01) G03F 7/34 (2006.01)

Patent

CA 1242100

Abstract of the Disclosure The present invention relates to a photosensitive transfer material, which comprises a flexible temporary support film which is preferably transparent, a thermo- plastic photosensitive layer, optionally a flexible cover film on the free side of the photosensitive layer and, optionally, an intermediate layer between the support film and the photosensitive layer. The photosensitive transfer material is suitable for manufacturing photore- sist stencils and solder masks. The temporary support film has a rough surface which exerts an embossing effect on the surface of the photosensitive layer and the inter- mediate layer, respectively. The mat-finish of the intermediate layer prevents an irregular deformation of this layer in moist air, while the mat-finish of the photosensitive layer precludes unwanted reflections.

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