Photostructurable polyimide mixtures

Details Photostructurable polyimide mixtures Photostructurable polyimide mixtures

C - Chemistry, Metallurgy

08

L

400/4601

C08L 79/08 (2006.01) C08G 73/10 (2006.01) G03F 7/038 (2006.01)

Patent

CA 1281146

Photostructurable polyimide mixtures Abstract The present invention relates to compositions comprising a) at least one polyimide having an inherent viscosity of at least 0.1 dl/g (measured at 25°C on a 0.5% by weight solution in N-methyl- pyrrolidone) and containing at least 50 mol % of structural units of the formula I Image (I), in which m and p independently of one another are integers from 0 to 4, n is an integer from 0 to 3, R1 and R2 independently of one another are C1-C6-alkyl or C1-C6-alkoxy and R3 is a divalent radical of an aromatic diamine which is substituted in at least one ortho-posi- tion relative to at least one N atom by alkyl, alkoxy, alkoxyalkyl, cycloalkyl or aralkyl or in which two adjacent C atoms of the aromatic radical are substituted by alkylene, and b) at least one aromatic polyimide which is soluble in organic solvents and photocrosslinkable and which contains at least 50 mol %, relative to the total quantity of diamine units, of radicals R3 and at least 50 mol %, relative to the total quantity of aromatic tetracarboxylic acid units, of tetravalent aromatic tetracarboxylic acid radicals includ- ing at least one benzophenone unit. The polyimide mixtures are distinguished by good adhesion to various substrates and have a high photosensitivity. They can be used for the production of protective coatings and relief structures and are particularly suitable for the production of etch masks.

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