Physical vapor deposition of titanium nitride on a...

Details Physical vapor deposition of titanium nitride on a... Physical vapor deposition of titanium nitride on a...

C - Chemistry, Metallurgy

23

C

C23C 16/02 (2006.01) C04B 35/80 (2006.01) C04B 41/52 (2006.01) C04B 41/53 (2006.01) C04B 41/85 (2006.01) C04B 41/89 (2006.01) C04B 41/91 (2006.01) C23C 14/02 (2006.01) C23C 14/06 (2006.01) C23C 14/18 (2006.01) C23C 16/34 (2006.01)

Patent

CA 2077757

2077757 9114017 PCTABS00007 A process for physical vapor deposition of a refractory coating such as titanium nitride on a nonconductive substrate such as a ceramic substrate and the coated substrate produced thereby. The nonconductive substrate is coated by cleaning the nonconductive substrate surfaces and then depositing a first layer of a refractory metal such as titanium metal on the nonconductive substrate by physical vapor deposition. A second layer of a refractory compound such as titanium nitride is then deposited on the first layer by physical vapor deposition to produce a coated nonconductive substrate having enhanced coating adhesion.

Affiliated with

Also associated with

Rating

Physical vapor deposition of titanium nitride on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Physical vapor deposition of titanium nitride on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Physical vapor deposition of titanium nitride on a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2037695