Piezoelectric substrate fabrication process

H - Electricity – 01 – L

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18/1166, 356/200

H01L 41/22 (2006.01) H01L 41/187 (2006.01) H01L 41/24 (2006.01)

Patent

CA 1088219

ABSTRACT OF THE DISCLOSURE A method of fabricating a lead titanate piezoelectric surface acoustic wave substrate comprises combining lead oxide, titanium tetra-n-butoxide, lanthanum oxide, and manganese dioxide, with a hydrocarbon solvent and adding water to the combination to form a slurry in which titanium polyester is precipitated unto the lead oxide and lanthanum and manganese oxides. The slurry is dried by heating to a temperature sufficient to remove the liquids therefrom but below the temperature at which an exothermic reaction between the included hydrogen, oxygen and carbon occurs. A first calcining operation produces the exothermic reaction and forms lead titanate afterwhich the lead titanate is heated to and maintained as a temperature above that produced by the exothermic reaction. The lead titanate is then ground to produce powdered lead titanate and a second calcining is carried out to produce structural annealing of the powdered lead titanate. Binder materials are added and the combination of powdered lead titanate and binder materials is cold-pressed into substantially planar substrates. After removal of the binders by heating, the substrates are fired to reduce porosity and poled to impart a piezoelectric characteristic.

293488

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