H - Electricity – 04 – R
Patent
H - Electricity
04
R
H04R 17/10 (2006.01) A61B 8/12 (2006.01) B06B 1/06 (2006.01) G01N 29/24 (2006.01)
Patent
CA 2411598
With respect to a conventional and general supersonic probe, it is necessary to apply a special patterning to a piezoelectric element, so that this involves a problem such that the supersonic probe is difficult to manufacture. Alternatively, in the case of bonding the conducting wire to the piezoelectric element with the conductive adhesive or the like, it is necessary to make the thickness of the conductive adhesive and the thickness of the conductive wire less than or equal to that of the above mentioned acoustic matching layer, so that it is very difficult to manufacture and the thickness of the acoustic matching layer becomes thicker than the optimum thickness. This involves a problem such that the detection sensitivity has been deteriorated. In order to solve the above described problems, a piezoelectric transducer according to the present invention is constructed in a laminated layer such that a piezoelectric element, to which electrodes are provided at the opposite surfaces, is fixed on a substrate having a plurality of substrate electrodes and further, an acoustic matching layer for efficiently transmitting and receiving a supersonic wave is superposed on the above mentioned piezoelectric element. Additionally, one surface electrode among the surface electrodes, which are respectively provided on the opposite surfaces of the above mentioned piezoelectric element, is connected to the above mentioned substrate electrodes with conductivity as superimposed with each other and other surface electrode is connected to the above mentioned substrate electrodes with conductivity via the conductive member and further, other surface electrode has a connection structure such that the above mentioned conductive member is connected thereto within the thickness of the acoustic matching layer without being exposed.
Muramatsu Hiroyuki
Nakamura Takashi
Shinogi Masataka
Borden Ladner Gervais Llp
Seiko Instruments Inc.
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