Pin arrangement for a backplane

H - Electricity – 05 – K

Patent

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356/11

H05K 1/02 (2006.01) H05K 1/14 (2006.01) H05K 3/22 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1169163

PIN ARRANGEMENT FOR A BACKPLANE Abstract of the Disclosure A backplane, in the form of a printed circuit board (PCB), is provided with an arrangement of electrically conductive pins for increasing the ease and versatility of providing electrical interconnections. The back surface of the "backplane" carries four parallel columns of pins for each "circuit board" location. At each circuit board location, on the backplane, the pins of two of these four parallel columns protrude from the back surface, extend through the backplane, and protrude from the front surface where they are available to accept the circuit board. The remaining two columns of pins, at each circuit board location, are carried by the backplane and protrude only from the back surface. The pins of one of these columns (i.e. protruding only from the back surface) are electrically connected, pin for pin in a one-to-one relationship, to the pins of one of the columns of pins that protrude from both the back and front surfaces of the backplane. The pins of the other column of pins (i.e protruding only from the back surface) are electrically connected, pin for pin, to respective pins in corresponding columns at each circuit board location. - i -

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