Pinning structures for superconducting films and method for...

Details Pinning structures for superconducting films and method for... Pinning structures for superconducting films and method for...

H - Electricity

01

L

H01L 39/12 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2081142

PINNING STRUCTURES FOR SUPERCONDUCTING FILMS AND METHOD FOR MAKING SAME ABSTRACT The pinning structure for high-Tc superconductors comprises a substrate (1), a plurality of protrusions (3) of nanometer dimension and with mutual distances in the nanometer range, deposited on the surface (2) of said substrate (1), and a superconducting film (4) deposited on said substrate (1) and embedding said protrusions (3) in a superconductor matrix. The protrusions (3) may consist of a metal, or a semiconductor, or an insulator. The manufacturing of the pinning structure starts from a substrate (1) onto which a predetermined number of protrusions (3) is deposited in predetermined locations as required by the specific application. Finally, the superconductor film (4) is deposited on top of the same substrate (1).

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