Pipe handling system for laser and other pipe treating...

Details Pipe handling system for laser and other pipe treating... Pipe handling system for laser and other pipe treating...

B - Operations, Transporting

23

K

B23K 26/08 (2006.01) B23K 26/38 (2006.01) B23K 26/42 (2006.01)

Patent

CA 2365294

The invention provides a pipe handling system which can transform a flat XY cutting system into a pipe cutting system which maintains very accurate pipe positions for laser, plasma, mechanical or other material processes, regardless of distortions in the pipe. The invention also provides a pipe handling system which can accommodate longer pipes, and a large range of pipe diameters. The pipe handling system is simpler, lighter and much more economical than conventional pipe handling systems.

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