Placement mechanism

Details Placement mechanism Placement mechanism

B - Operations, Transporting

23

P

270/140

B23P 19/00 (2006.01) H01L 21/683 (2006.01)

Patent

CA 1246625

12 ABSTRACT A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.

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