Planar heat pipe for cooling

F - Mech Eng,Light,Heat,Weapons – 28 – D

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Details

F28D 15/04 (2006.01)

Patent

CA 2640519

There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.

L'invention concerne un caloduc plat destiné au refroidissement qui est incorporé dans une carte de circuits imprimés pour refroidir des composants de dissipation thermique (13). Ce caloduc plat comprend deux panneaux (1, 2) recouverts d'un enrobage métallique sur un côté (4, 5), au moins un desdits panneaux (1, 2) étant rainuré (9) sur son côté d'enrobage métallique. Les panneaux (1, 2) sont assemblés par leurs côtés d'enrobage métallique pour former une cavité (8) fermée hermétiquement, celle-ci (8) étant remplie avec un liquide (10). Le liquide (10) circule par action capillaire le long des rainures (9) en direction des zones exposées à la chaleur, où il s'évapore.

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