H - Electricity – 03 – H
Patent
H - Electricity
03
H
H03H 9/05 (2006.01) H03H 3/08 (2006.01)
Patent
CA 2331277
According to the inventive thermomechanical method for planing a resist layer which is applied on a partially raised supporting surface, a resist structure, especially an encapsulation for electronic components, is obtained. To this end, a dry resist film (2) which is comprised of a composite made of a temperature resistant protective film (3) and of a photosensitive layer (4) is applied with the photosensitive layer (4) thereof on the supporting surface (6). The dry resist film (2d) is planed using pressure and heat, whereupon the photosensitive layer is exposed. Afterwards, the protective film (3) is removed and the photosensitive layer is developed.
Selon un procédé thermomécanique permettant de rendre plane une couche de résist appliquée sur une surface de support partiellement bosselée, on obtient une structure de résist, en particulier un encapsulage pour composants électroniques. A cet effet, on applique un film de résist sec (2), constitué d'un composite formé d'un film de protection (3) résistant aux températures élevées et d'une couche photosensible (4), sur la surface de support (6), de telle sorte que ladite couche photosensible (4) soit en contact avec la surface de support (6), et le film de résist sec (2d) est rendu plan par pression et apport de chaleur. Ensuite, la couche photosensible est exposée, on enlève le film de protection (3), et cette couche photosensible est développée.
Epcos Ag
Fetherstonhaugh & Co.
LandOfFree
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