Planarizing bumps for interconnecting matching arrays of...

Details Planarizing bumps for interconnecting matching arrays of... Planarizing bumps for interconnecting matching arrays of...

H - Electricity

01

L

H01L 21/60 (2006.01) H01L 21/48 (2006.01) H01L 23/485 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2139314

An electronic device having a plurality of electrodes is prepared for bonding with another electronic device by positioning metal bumps surrounded by a resin on selected electrodes. The bumps are then diamond turned to that the outer surfaces of all of them lie substantially in a plane. The resin is then removed.

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