Planarizing layer for semiconductor substrates such as solid...

Details Planarizing layer for semiconductor substrates such as solid... Planarizing layer for semiconductor substrates such as solid...

H - Electricity

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345/1

H01L 31/04 (2006.01) H01B 3/44 (2006.01) H01L 21/312 (2006.01) H01L 31/0216 (2006.01)

Patent

CA 1213964

-0- PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS Abstract A device is disclosed comprising a non-planar semiconductor substrate and a planarizing layer there- on, the planarizing layer having a maximum thickness that is no greater than about 3µ and a planarization factor P?1Ø In a preferred embodiment, the layer comprises a polymer formed from a liquid monomer coated onto the substrate and thereafter polymerized.

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