Plasma cutting method

Details Plasma cutting method Plasma cutting method

B - Operations, Transporting

23

K

B23K 10/00 (2006.01) H05H 1/34 (2006.01)

Patent

CA 2212666

A plasma cutting method using a plasma cutting apparatus that comprises a nozzle having an orifice for thinning a plasma arc and secondary gas jet means for supplying a secondary gas in such a manner as to encompass the end of the nozzle. While a nonoxidizing gas is used as starting plasma gas, a nonoxidizing gas is supplied as a secondary starting gas so as to establish a nonoxidizing gas atmosphere in the proximity of the nozzle.

La présente invention concerne un procédé de découpage par plasma mettant en oeuvre un appareil de découpage par plasma qui comporte une tuyère pourvue d'un orifice rendant plus fin l'arc de plasma et un organe de projection de gaz secondaire fournissant le gaz secondaire de façon à envelopper l'extrémité de la tuyère. Le gaz utilisé pour l'amorçage du plasma est un gaz non oxydant. De la même façon, le gaz délivré comme gaz d'amorçage secondaire est un gaz non oxydant, ce qui permet de créer au voisinage de la tuyère une atmosphère gazeuse non oxydante.

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