Plasma deposited barrier coating comprising an interface...

B - Operations – Transporting – 05 – D

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B05D 7/24 (2006.01) B05D 7/00 (2006.01) C23C 16/04 (2006.01) B05D 7/22 (2006.01)

Patent

CA 2416518

The invention concerns in particular a method using a low pressure plasma for depositing a barrier coating on a substrate to be treated, wherein the plasma is obtained by partial ionisation, under the action of an electromagnetic field, of a reaction fluid injected under low pressure in a treating zone. The method is characterised in that it comprises at least a step which consists in depositing on the substrate an interface layer which is obtained by bringing to plasma state a mixture comprising at least an organosilicon compound and a nitrogenous compound, and a step which consists in depositing, on the interface layer, a barrier layer, essentially consisting of a silicon oxide of formula SiOx.

L'invention se rapporte notamment à un procédé mettant en oeuvre un plasma à faible pression pour déposer un revêtement barrière sur un substrat à traiter, du type dans lequel le plasma est obtenu par ionisation partielle, sous l'action d'un champ électromagnétique, d'un fluide réactionnel injecté sous faible pression dans une zone de traitement, caractérisé en ce qu'il comporte au moins une étape consistant à déposer sur le substrat une couche d'interface qui est obtenue en portant à l'état de plasma un mélange comportant au moins un composé organosilicé et un composé azoté, et une étape consistant à déposer, sur la couche d'interface, une couche barrière, composée essentiellement d'un oxyde de silicium de formule SiOx.

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