Plasma enhanced chemical vapor deposition device

C - Chemistry – Metallurgy – 23 – C

Patent

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Details

C23C 16/50 (2006.01) C03C 17/00 (2006.01) C23C 16/455 (2006.01) C23C 16/509 (2006.01) C23C 16/54 (2006.01) C23C 16/44 (2006.01)

Patent

CA 2060917

ABSTRACT OF THE INVENTION A plasma enhanced chemical vapor deposition device for coating large three-dimensional substrates is provided. The device includes elongated metal rod cathodes each having an aperture at one end that is in communication with a process gas source, with the aperture extending substantially the length of the rod to form a substantially cylindrical bore within the rod, wherein the bore is in communication with the rod exterior through a series of holes in the rod, and wherein the diameter of the holes is substantially less than the bore diameter so that the gas pressure is substantially uniform throughout the bore during the deposition process. The rod cathodes, which are situated within an evacuable coating chamber, are arranged in a readily expandable matrix into which substrates to be coated are positioned.

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