Plasma surface processing apparatus

Details Plasma surface processing apparatus Plasma surface processing apparatus

H - Electricity

01

L

H01L 21/205 (2006.01) C23C 16/452 (2006.01) C23C 16/455 (2006.01) C23C 16/513 (2006.01) H01L 21/3065 (2006.01)

Patent

CA 2471987

In a plasma film forming apparatus, two first electrodes 51 connected to a power source 4 and two grounded second electrodes 52 are arranged in the order of the second electrode 52, the first electrode 51, the first electrode 51 and the second electrode 52. A first flow passage 50a formed between the central first electrodes 51 allows a raw material gas (first gas) for being formed into a film to pass therethrough. A plasma discharge space 50b of a second flow passage formed between the first and second electrodes 51, 52 on the both sides allows an excitable gas (second gas) to pass therethrough, which excitable gas is exited by plasma such that the raw material can be formed into a film, but that the excitable gas itself is merely excited but not formed into a film. Those gases are converged at a crossing part 20c between the first and second flow passages and blown off via a common blowoff passage 25a. By this, the apparatus composing members such as electrodes can be prevented from being adhered with a film.

L'invention concerne un système de formation de film par plasma, comprenant deux premières électrodes (51) connectées à une alimentation (4) et deux secondes électrodes (52) mises à la terre, disposées séquentiellement comme suit : la seconde électrode (52), la première électrode (51), la première électrode (51) et la seconde électrode (52). Un gaz pour matière de film (premier gaz) passe dans un premier circuit d'écoulement (50a) formé entre les premières électrodes (51) se trouvant au centre. Un gaz d'excitation (second gaz) qui est excité de manière qu'il forme un film à partir de la matière, au moyen de plasma, mais ne formant un film que lorsqu'il est excité, passe dans des seconds circuits d'écoulement ou des espaces de décharge de plasma (50b), entre les première et secondes électrodes (51, 52) des côtés opposés. Ces gaz se mélangent (20c) au niveau du croisement entre les premier et seconds circuits d'écoulement et sont déchargés par un circuit de décharge commun (25c). Ainsi, le film ne peut se déposer sur des éléments constitutifs du systèmes, tels que des électrodes.

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