Plasma vapor deposition apparatus

C - Chemistry – Metallurgy – 23 – C

Patent

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Details

C23C 14/24 (2006.01) C23C 14/04 (2006.01) C23C 14/32 (2006.01) C23C 14/56 (2006.01)

Patent

CA 2096593

The present invention provides a plasma vapor deposition apparatus and inline apparatus thereof which comprise, for the purpose of permitting formation of a high-quality film of ITO, for example, at a high productivity, a drive and a horizontally rotating circular holding plate connected thereto, the circular holding plate having a vapor source material mounting section concentric with the rotation axis thereof provided on the surface thereof, and a high-frequency exciting means having coil-shaped electrodes.

La présente invention a pour objet une installation ainsi qu'un processus de dépôt en phase vapeur activé par plasma permettant de réaliser, à productivité élevée, des placages de haute qualité, de type ITO par exemple, comportant un mécanisme d'entraînement relié à une plaque de fixation circulaire animée d'un mouvement de rotation horizontale, la plaque de fixation circulaire en question possédant une partie permettant le montage concentrique de la source de vapeur par rapport à l'axe de rotation de la surface de montage, ainsi qu'une source d'excitation à haute fréquence dotée d'électrodes spiralées.

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