Plastic encapsulated integrated circuit package with...

Details Plastic encapsulated integrated circuit package with... Plastic encapsulated integrated circuit package with...

H - Electricity

05

K

356/143, 347/8

H05K 9/00 (2006.01) H01L 23/495 (2006.01) H01L 23/552 (2006.01) H01L 23/60 (2006.01)

Patent

CA 1278618

ABSTRACT OF THE DISCLOSURE A plastic encapsulated integrated circuit package in which a chip is secured to the upper surface of a base and is connected to leads which have their lower surfaces in a plane above that of the bottom of the base. An electrostatic shield is electrically connected to the bottom of the base and underlies the leads without touching them, to reduce crosstalk. The support for the base is integrally connected by a conductive strip to the lead for the ground pin of the chip, to ground the shield. The whole is plastic encapsulated. To permit encapsulation, the shield extends towards but stops short of the dam bars for the leads.

542524

Affiliated with

Also associated with

Rating

Plastic encapsulated integrated circuit package with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic encapsulated integrated circuit package with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic encapsulated integrated circuit package with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1236635