Plastic encapsulated semiconductor device and lead frame...

H - Electricity – 01 – L

Patent

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56/146, 356/172

H01L 23/48 (2006.01)

Patent

CA 1209721

ABSTRACT OF THE DISCLOSURE A lead frame having a substrate support which supports a semoconductor substrate connected to a top of one of a plurality of external leads extending in the same direction from a connecting band, wherein a three- dimensional pattern of a groove shape or a bore shape is formed on at least part of one surface of the substrate support the other surface of which supports the semiconductor substrate.

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