H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/172
H05K 5/06 (2006.01) H01L 21/56 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01) H01L 25/11 (2006.01)
Patent
CA 1079868
ABSTRACT OF THE DISCLOSURE The present invention provides a method of preparing plastic encapsulated semiconductor devices which comprise the steps of: preparing a connected metal plate in which a plurality of semiconductor element holding parts are connected in series in one direction with at least two connecting arms, disposed between each pair of semiconductor holding parts, said connecting arms each having an area smaller than that of said semiconductor element holding parts; forming said connecting arms inside the side surfaces of said semiconductor element holding parts in the connecting direction; providing semiconduct- or elements having a pair of main surfaces in parallel with each other; bonding the semiconductor elements on one main surface of said semiconductor element holding parts; providing a lead frame having a plurality of spaced parallel ribbon lead electrodes extending from a common connecting part; bonding the free ends of the ribbon lead electrodes on the other of the main surfaces of said semiconductor elements; plastic encapsulating said semi- conductor elements, said semiconductor element holding parts and said ribbon lead electrodes except said connecting arms, the other main surface of said semiconductor element holding parts and the connecting part of said ribbon lead electrodes, and separating said semiconductor devices by cutting said connecting arms of said connected metal plate and the connecting part of said ribbon lead electrodes.
275206
Imanaka Kiyoji
Ishibashi Kiyoshi
Itoga Keiji
Morita Yutaka
Watanabe Toshimi
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