Plastic encapsulated semiconductor devices and method of...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/172

H01L 29/91 (1980.01) H01L 25/08 (1980.01)

Patent

CA 1108773

ABSTRACT OF THE DISCLOSURE The present invention provides a connected metal plate which comprises a plurality of semiconductor element holding parts which are connected with at least two connecting arms to one direction; and said connecting arms having area being smaller than those of said semiconductor element holding parts and said connecting arms being disposed inside of the side surfaces of said semiconductor element holding parts in the connecting direction.

344749

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Plastic encapsulated semiconductor devices and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic encapsulated semiconductor devices and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic encapsulated semiconductor devices and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1004348

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.