Plastic housing designed to accommodate electronic and/or...

Details Plastic housing designed to accommodate electronic and/or... Plastic housing designed to accommodate electronic and/or...

H - Electricity

05

K

H05K 5/00 (2006.01) B29C 45/14 (2006.01) H01B 3/30 (2006.01) H01L 23/498 (2006.01) H01R 13/405 (2006.01) H05K 5/02 (2006.01)

Patent

CA 2206097

The invention concerns a thermoplastic housing designed to hold electronic and/or micromechanical components and into which metal conductor tracks pass, the conductor tracks being injection moulded in one of the housing walls. The thermoplastic has a flexural strength of at least 200 MPa.

La présente invention concerne un boîtier destiné à recevoir des composants électroniques et/ou micromécaniques. Il est fait d'une matière thermoplastique dans laquelle passent des tracés conducteurs métalliques qui, à cette fin, sont injectés dans une paroi du boîtier. La matière plastique présente une résistance à la flexion d'au moins 200 MPa.

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