Plastic semiconductor package with aluminum heat spreader

Details Plastic semiconductor package with aluminum heat spreader Plastic semiconductor package with aluminum heat spreader

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/28 (2006.01) H01L 23/31 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01) H01L 23/48 (2006.01)

Patent

CA 2144881

There is provided a molded plastic electronic package (40) having improved thermal dissipation. A heat spreader (26), formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin (30). Forming a black anodization layer (42) on the surface of the heat spreader (26) improves both thermal dissipation and adhesion to the molding resin.

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