C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/04 (2006.01) C08J 9/00 (2006.01) E04B 1/76 (2006.01)
Patent
CA 2151052
Disclosed is a method of insulating a surface or enclosure by applying to the surface or enclosure a polymeric foam structure of a polymer material and carbon black. The carbon black is generally uniformly dispersed in the polymer matrix in the form of discrete, individual particles substantially free of agglomeration. A preferred carbon black is thermal black. The carbon black is easily processed and integrated into the present structure, and provides a lower thermal conductivity for a given loading. Further disclosed is a process for making the foam structure. Further disclosed is an extruded, insulative foam structure of the type described above.
Bartz Arnold M.
Hitchcock Martin K.
Dow Global Technologies Inc.
Smart & Biggar
The Dow Chemical Company
LandOfFree
Plastic structures containing thermal grade carbon black does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plastic structures containing thermal grade carbon black, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic structures containing thermal grade carbon black will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1755686