C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/02 (2006.01) B32B 7/12 (2006.01) C09D 179/04 (2006.01) C09J 11/00 (2006.01) C09J 163/00 (2006.01) C09J 179/04 (2006.01) C08L 63/00 (2006.01) C08L 79/04 (2006.01)
Patent
CA 2188344
An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereaf- ter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic compo- nents in such applications as aircraft, spacecraft, and automobiles given its highly conduc- tive and comprehensive metallic coating.
Hermansen Ralph D.
Punsly Brian M.
Seetoo Wai-Cheng
He Holdings Inc.
Sim & Mcburney
The Boeing Company
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