Plated non-conductive products and plating method for the same

Details Plated non-conductive products and plating method for the same Plated non-conductive products and plating method for the same

C - Chemistry, Metallurgy

23

C

C23C 18/31 (2006.01) C23C 18/16 (2006.01) C23C 18/18 (2006.01) H01B 1/20 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2254834

Object A method of forming a plate layer with extremely high adhesiveness on a surface of a non-conductive product. Solution A method of plating a non-conductive product comprising the steps of: forming a coating film on necessary portions of a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (A) resin vehicles 20 to 80 weight % (B) conductive whisker 80 to 20 weight %, and executing electroless plating on a surface of the coating film, or a method for improving adhesiveness of a plate layer by forming , when forming a coating film, microvoids in a surface of the coating film.

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