Platen arrangement for hot melt ink jet apparatus

Details Platen arrangement for hot melt ink jet apparatus Platen arrangement for hot melt ink jet apparatus

B - Operations, Transporting

41

J

101/96.0218

B41J 2/17 (2006.01) B41J 2/175 (2006.01)

Patent

CA 1318547

Platen Arrangement for Hot Melt Ink Jet Apparatus Abstract In the particular embodiment described in the specification, a hot melt ink jet system includes a temperature-controlled platen (16) provided with a heater (25) and a thermoelectric cooler (28) electri- cally connected to a heat pump (26) and a temperature control unit (22) for controlling the operation of the heater and the heat pump to maintain the platen tem- perature at a desired level. The apparatus also in- cludes a second thermoelectric cooler (35) to solidify hot melt ink in a selected zone more rapidly to avoid offset by a pinch roll coming in contact with the surface of the substrate to which hot melt ink has been applied. An airtight enclosure (17) surrounding the platen is connected to a vacuum pump (21) and has slits (18, 19) adjacent to the platen to hold the substrate in thermal contact with the platen. (Fig. 2)

576542

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