Platen assembly for a vacuum processing system

Details Platen assembly for a vacuum processing system Platen assembly for a vacuum processing system

C - Chemistry, Metallurgy

23

C

356/195

C23C 14/34 (2006.01) C23C 14/50 (2006.01) C23C 14/56 (2006.01) H01L 21/687 (2006.01)

Patent

CA 1303254

ABSTRACT OF THE DISCLOSURE A platen assembly (66) for holding a semiconductor wafer (30) for vacuum processing. The platen is a substantially solid, circular plate (194) which is surrounded by a movable clamp assembly (192) in the form of a ring having formed thereon a first set of projections (257, 258) for initially receiving a wafer above the plate, and a second set of projections (256) spaced axially from the first set for clamping the wafer to the plate. The ring is formed of two parts (251, 252) spaced apart axially and connected by spring members (254). A slot (255) is formed in the ring to permit the entry of wafers between the sets of projections. The clamp assembly is moved between a water receiving position and a clamping position by an annular fluid cylinder (228) and piston (232) assembly. The fluid cylinder and piston assembly includes bellows seals acting between the cylinder and piston rods (238) to maintain the vacuum integrity of the system.

614869

Affiliated with

Also associated with

Rating

Platen assembly for a vacuum processing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Platen assembly for a vacuum processing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Platen assembly for a vacuum processing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1307163