Plating apparatus

Details Plating apparatus Plating apparatus

C - Chemistry, Metallurgy

25

D

204/129

C25D 17/00 (2006.01)

Patent

CA 1141702

ABSTRACT An apparatus for plating workpieces by electrolytic treatment in several steps comprises means (2) to hold and rotate the work- piece, a plurality of electrodes, at least one of which being adapted, in each step, to be located at the workpiece by means of a holder (10), and means to supply, in each step, a certain electrolyte to the region of the rotating workpiece and the non- rotating electrode. A plurality of electrode holders (10) with associated electrodes are arranged on a common carrier (11), which is adjustably movable, e.g, rotatable, relative to said holding means and the rotatable workpiece to selectively locate an optional electrode holder with associated electrode(s) intended for the desired treatment step in an operative position relative to the rotatable workpiece. (Fig 2).

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