C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 7/00 (2006.01) C25D 5/08 (2006.01) C25D 7/04 (2006.01) C25D 17/00 (2006.01) C25D 17/12 (2006.01) C25D 21/10 (2006.01) F02F 1/00 (2006.01)
Patent
CA 2568579
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path (29) communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
Appareil de placage comprenant une électrode tubulaire (16) placée dans une section creuse (12) d~une pièce à usiner (11). L~électrode tubulaire (16) comprend un trou traversant (16a) formé dans la direction longitudinale. Un espace circulaire en forme de tube (S1) dans lequel s~écoule un liquide de placage (17) est formé entre l~électrode tubulaire placée dans la section creuse et une paroi périphérique intérieure (14) de la section creuse. Le liquide de placage s~écoule en spirale de l~extrémité inférieure de l~espace à l~extrémité supérieure par l~action d~un trajet d~écoulement générateur de vortex (29) communiquant avec l~extrémité inférieure de l~espace. Le liquide de placage qui a atteint l~extémité supérieure passe par le trou traversant de l~électrode tubulaire.
Miyasaka Hajime
Ogawa Yoshimitsu
Honda Motor Co. Ltd.
Smart & Biggar
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