Plating bath for electrodeposition of aluminum and process...

Details Plating bath for electrodeposition of aluminum and process... Plating bath for electrodeposition of aluminum and process...

C - Chemistry, Metallurgy

25

D

204/23.5

C25D 3/44 (2006.01)

Patent

CA 1311710

- 11 - ABSTRACT OF THE DISCLOSURE In a plating bath for electrodeposition of aluminium, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm2 or varied in the range from 0.1 to 30 A/dm2.

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