Plating compositions and processes

Details Plating compositions and processes Plating compositions and processes

C - Chemistry, Metallurgy

23

C

204/29, 6/4

C23C 30/00 (2006.01) C25D 3/48 (2006.01) C25D 3/62 (2006.01)

Patent

CA 2036222

A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (eg nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying metal ions if present, such as citic acid or oxalic acid; and a rate promoting additive compound of general formula IA or IB: (see formula IA) (see formula IB) wherein: each of R1 and R2 independently represents a hydrogen or halogen atom or a formyl, carbamoyl, C1-4 alkyl, amino, phenyl or benzyl group, wherein the alkyl, phenyl and benzyl moieties may optionally be substituted with one or more hydroxy or amino groups or halogen atoms; R3 represents a C1-6 alkylene radical which may optionally be hydroxylated; and Q represents -SO2- or -CO-. The rate promoter extends the plating current density range of the composition, particularly by reducing or preventing burn at high current densities, and gives a net increase in achievable plating speed for bright deposition.

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