Plating solution containing an inorganic redox couple and a...

Details Plating solution containing an inorganic redox couple and a... Plating solution containing an inorganic redox couple and a...

C - Chemistry, Metallurgy

23

C

6/4, 96/57, 117/

C23C 18/40 (2006.01)

Patent

CA 1069367

ABSTRACT: A copper-plating bath suitable for reprographic uses and for making electrically conducting metal patterns with one of the redox pairs V2+/V3+, Ti2+/Ti3+, or Cr2+/Cr3+ as a reducing agent, ascorbic acid with an acid acceptor, or the redox pair Fe2+/Fe3+ together with an organic carboxylic acid and a complexing agent for cuprous ions.

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