C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/56 (2006.01) B01D 53/22 (2006.01) B01D 67/00 (2006.01) C01B 3/56 (2006.01) C25D 3/52 (2006.01)
Patent
CA 2604421
The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.
Ishikawa Tomoko
Kitada Katsutsugu
Marks & Clerk
Tanaka Kikinzoku Kogyo K.k.
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