Plating solution of palladium alloy and method for plating...

C - Chemistry – Metallurgy – 25 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C25D 3/56 (2006.01) B01D 53/22 (2006.01) B01D 67/00 (2006.01) C01B 3/56 (2006.01) C25D 3/52 (2006.01)

Patent

CA 2604421

The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Plating solution of palladium alloy and method for plating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating solution of palladium alloy and method for plating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating solution of palladium alloy and method for plating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-2082356

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.