C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/50 (2006.01)
Patent
CA 2138396
A platinum plating bath electrolyte for plating platinum or platinum alloys contains a platinum(II) salt, in which the plati- num(II) is present in solution as Pt(H2O)42+, and permits efficient deposition of Pt.
Gregory Adrian John
Levason William
Pletcher Derek
Johnson Matthey Public Limited Company
Ridout & Maybee Llp
LandOfFree
Platinum plating bath electrolyte does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Platinum plating bath electrolyte, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Platinum plating bath electrolyte will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1428567