Plywood, and a process for preparing plywood

Details Plywood, and a process for preparing plywood Plywood, and a process for preparing plywood

C - Chemistry, Metallurgy

08

G

C08G 12/32 (2006.01) B27D 1/04 (2006.01) C09J 161/28 (2006.01)

Patent

CA 2547766

The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound (T), formaldehyde (F) and optionally urea, wherein the molar F/(Nh2)2 ratio of the adhesive layer lies between 0.70 and 1.10 and the molar F/T ratio of the adhesive layer lies between 1.0 and 3.5. The invention further relates to a process for the preparation of plywood.

L'invention concerne du contreplaqué qui comprend au moins deux couches de feuille de bois et au moins une couche adhésive. Cette dernière comprend une composition résineuse renfermant un composé de trazine (T), du formaldéhyde (F) et éventuellement de l'urée. Le rapport molaire F7(NH¿2?)¿2? de la couche adhésive est compris entre 0,70 et 1,10 et son rapport molaire F/T entre 1,0 et 3,5. L'invention concerne également un procédé de préparation de contreplaqué.

Affiliated with

Also associated with

Rating

Plywood, and a process for preparing plywood does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plywood, and a process for preparing plywood, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plywood, and a process for preparing plywood will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1860180