Polish composition

Details Polish composition Polish composition

C - Chemistry, Metallurgy

09

G

C09G 1/16 (2006.01) C09G 1/04 (2006.01)

Patent

CA 2212901

The present invention relates to a wipe-on polish composition which contains no wax or abrasive components. The polish requires minimal effort to wipe out to a thin, glossy, streak-free, hydrophobic film. The polish is comprised of an emulsion that contains an organopolysiloxane and a volatile diluent.

Cette invention concerne une composition de polissage à appliquer au chiffon qui ne contient ni cire ni composants abrasifs. La composition exige un effort minimal d'essuyage pour donner une pellicule hydrphobe mince, luisante et sans traînée. La composition comprend une émulsion d'organopolysiloxane et un diluant volatil.

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